LNP™ THERMOCOMP™ Compound QFC0AI

LNP THERMOCOMP QFC0AI compound is based on Nylon 6/10 resin containing 50% glass fiber. Added feature of this material include: high modulus, high impact, low dielectric constant, low moisture absorption, good dimensional stability and good chemical resistance.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide 610 (Nylon 610)

Processing Technology

  • Injection Molding