LNP™ THERMOCOMP™ Compound RF006LXP

LNP THERMOCOMP RF006LXP compound is based on Nylon 6/6 resin containing 30% glass fiber. Added features of this grade include: Low Extractables.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide 66 (Nylon 66)

Processing Technology

  • Injection Molding