LNP™ THERMOCOMP™ Compound RF007SXP

LNP THERMOCOMP RF007SXP compound is based on Nylon 6/6 resin containing 35% glass fiber. Added features of this grade include: Heat Stabilized.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide 66 (Nylon 66)

Processing Technology

  • Injection Molding