LNP™ THERMOCOMP™ Compound RF00CSXP

LNP THERMOCOMP RF00CSXP compound is based on Nylon 6/6 resin containing 60% glass fiber. Added features of this grade include: Heat Stabilized

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide 66 (Nylon 66)

Processing Technology

  • Injection Molding