LNP™ THERMOCOMP™ Compound SC004

LNP THERMOCOMP SC004 compound is based on Nylon 12 resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide 12 (Nylon 12)

Processing Technology

  • Injection Molding