LNP™ THERMOCOMP™ Compound UF0067D

LNP THERMOCOMP UF0067D compound is based on Nylon resin containing 35% glass fiber. Added features of this grade include: High Stiffness/Strength.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide, Unspecified (Nylon, Unspecified)

Processing Technology

  • Injection Molding