LNP™ THERMOCOMP™ Compound UF007SXC

LNP THERMOCOMP UF007SXC compound is based on Polyphthalamide (PPA) resin containing 35% glass fiber. Added features of this grade include: Heat Stabilized.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyphthalamide (PPA)

Processing Technology

  • Injection Molding