LNP™ THERMOCOMP™ Compound UF008AR

LNP THERMOCOMP UF008AR compound is based on Polyphthalamide (PPA) resin, containing 40% glass fiber. Added features of this grade include: Mold Release.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyphthalamide (PPA)

Processing Technology

  • Injection Molding