LNP™ THERMOCOMP™ Compound UF00ASW

LNP THERMOCOMP UF00ASW compound is based on Polyphthalamide (PPA) resin containing 50% glass fiber. Added features of this grade include: Heat Stabilized, Hot Water Moldable.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyphthalamide (PPA)

Processing Technology

  • Injection Molding