LNP™ THERMOCOMP™ Compound XF006S

LNP THERMOCOMP XF006S compound is based on Amorphous Nylon resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide, Unspecified (Nylon, Unspecified)

Processing Technology

  • Injection Molding