LNP™ THERMOCOMP™ Compound Z1C00

THERMOCOMP Z1C00 is an injection moldable compounds with ultra-low dielectric constant under wide frequencies, with other features including dimension stability, high HDT and low water uptake. Target industries are electronics and electrical including 5G applications.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyphenylene Ether + PS (PPE+PS)

Processing Technology

  • Injection Molding