LNP™ THERMOCOMP™ Compound Z1C00I

LNP THERMOCOMP Z1C00I compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing proprietary fillers. Added features of this grade include: Ultra-Low Dielectric Constant and Loss Tangent, High HDT, Low Warpage, Excellent Surface Finishing and Chemical Resistant. It can also be Electro-less or Electro plated.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyphenylene Ether + PS (PPE+PS)

Processing Technology

  • Injection Molding