LNP™ THERMOCOMP™ AM Compound DC004XXA11

LNP THERMOCOMP AM DC004XXA11is a compound based on High Heat PC resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications, including mid-temperature autoclaving tooling. This compound can offer higher temperature performance than standard PC and avoid some of the processing challenges associated with high temperature materials.

Product Family

  • ADDITIVE MANUFACTURING

Polymer Family

Processing Technology