LNP™ THERMOCOMP™ AM Compound DF004XXAR1

LNP THERMOCOMP DF004XXAR1 compound is based on Polycarbonate (PC) resin containing 20% glass fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Excellent Ductility and Smooth Surface Finish.

Product Family

  • ADDITIVE MANUFACTURING

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Large Format Additive Manufacturing (LFAM)