LNP™ THERMOCOMP™ AM Compound EC004EXAR1

LNP THERMOCOMP EC004EXAR1 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber designed to provide a Wider Process Window and Easier Flow for Large Format Additive Manufacturing (LFAM) applications needing High heat performance. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide Low Thermal Expansion, High Temperature Performance, Excellent Strength-to-Weight Ratio, High Modulus and Low Creep.

Product Family

  • ADDITIVE MANUFACTURING

Polymer Family

  • Polyetherimide (PEI)

Processing Technology

  • Large Format Additive Manufacturing (LFAM)