LNP™ THERMOCOMP™ AM Compound EC004XXAR1

LNP THERMOCOMP EC004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher stiffness vs glass fiber. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.

Product Family

  • ADDITIVE MANUFACTURING

Polymer Family

  • Polyetherimide (PEI)

Processing Technology

  • Large Format Additive Manufacturing (LFAM)