LNP™ THERMOCOMP™ AM Compound EZ006EXAR1

LNP THERMOCOMP EZ006EXAR1is a compound based on Polyetherimide (PEI) resin containing 30% milled glass fiber for Large Format Additive manufacturing (LFAM) applications requiring better dimensional stability and low thermal expansion. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, offer high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.

Product Family

  • ADDITIVE MANUFACTURING

Polymer Family

  • Polyetherimide (PEI)

Processing Technology

  • Large Format Additive Manufacturing (LFAM)