LNP™ THERMOCOMP™ Compound DX11354X

LNP THERMOCOMP DX11354X compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Impact, Colorable.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polycarbonate (PC)

Processing Technology

  • Injection Molding