LNP™ THERMOCOMP™ Compound DX11355

LNP THERMOCOMP DX11355 compound is based on Polycarbonate (PC) resin containing proprietary fillers and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Impact, Non-Brominated, Non-Chlorinated Flame Retardant.

Product Family

LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

Polycarbonate (PC)

Processing Technology

Injection Molding

Where to buy

You can get in touch with us in these regions to buy the material

Colors

All colors are customizable. Refer our ColorXpress tool to check color availability

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Features

Key characteristics of the material

Dielectrics
Flame Retardant
Impact resistant
Laser Direct Structuring
Non Cl/Br flame retardant

Industry

Material previously used in

Automotive Interiors
Electrical
Mobile Phone - Computer - Tablets
Personal Accessory

Applications

Possible usage of material

Antenna
Data Transfer
Enclosures
EV Infrastructure
LED Lighting
Personal Computing
Wearables
Wireless Communications
mobile phone antenna
laptop antenna
wearable device antenna
lds
laser direct structuring
outdoor device antenna

Technical Datasheet Data

View different characteristics of the material at a standard test conditions

Region

ELECTRICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Relative Permittivity, 1 GHz	2.92	-	IEC 60250
Dissipation Factor, 1 GHz	0.007	-	IEC 60250

FLAME CHARACTERISTICS

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
UL Yellow Card Link	View	-	-
UL Recognized, 94V-0 Flame Class Rating	≥0.6	mm	UL 94

IMPACT

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Izod Impact, notched, 23°C	800	J/m	ASTM D256
Izod Impact, notched, -30°C	167	J/m	ASTM D256
Izod Impact, unnotched, -30°C	2120	J/m	ASTM D4812

INJECTION MOLDING

PROPERTIES	TYPICAL VALUES	UNITS
Drying Temperature	100 - 110	°C
Drying Time	3 - 4	Hrs
Drying Time (Cumulative)	8	Hrs
Maximum Moisture Content	0.02	%
Melt Temperature	275 - 300	°C
Nozzle Temperature	275 - 300	°C
Front - Zone 3 Temperature	260 - 300	°C
Middle - Zone 2 Temperature	255 - 295	°C
Rear - Zone 1 Temperature	250 - 290	°C
Hopper Temperature	60 - 80	°C
Mold Temperature	60 - 90	°C
Back Pressure	0.3 - 0.7	MPa
Screw Speed	40 - 70	rpm
Shot to Cylinder Size	30 - 80	%
Vent Depth	0.038 - 0.076	mm

MECHANICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Tensile Stress, yld, Type I, 50 mm/min	58	MPa	ASTM D638
Tensile Stress, brk, Type I, 50 mm/min	52	MPa	ASTM D638
Tensile Strain, yld, Type I, 50 mm/min	5.4	%	ASTM D638
Tensile Strain, brk, Type I, 50 mm/min	70	%	ASTM D638
Tensile Modulus, 50 mm/min	2600	MPa	ASTM D638
Flexural Stress, yld, 1.3 mm/min, 50 mm span	90	MPa	ASTM D790
Flexural Stress, brk, 1.3 mm/min, 50 mm span	89	MPa	ASTM D790
Flexural Modulus, 1.3 mm/min, 50 mm span	2400	MPa	ASTM D790

PHYSICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Density	1.27	g/cm³	ASTM D792
Moisture Absorption, (23°C/50% RH/24 hrs)	0.01	%	ASTM D570
Mold Shrinkage, flow, 24 hrs	0.5	%	ASTM D955
Mold Shrinkage, xflow, 24 hrs	0.5	%	ASTM D955
Melt Flow Rate, 300°C/1.2 kgf	12	g/10 min	ASTM D1238

THERMAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
HDT, 1.82 MPa, 3.2mm, unannealed	114	°C	ASTM D648
CTE, -40°C to 40°C, flow	6.2E-05	1/°C	ASTM E831
CTE, -40°C to 40°C, xflow	6.7E-05	1/°C	ASTM E831
Relative Temp Index, Elec	80	°C	UL 746B
Relative Temp Index, Mech w/impact	80	°C	UL 746B
Relative Temp Index, Mech w/o impact	80	°C	UL 746B

THIS SITE USES COOKIES

LNP™ THERMOCOMP™ Compound DX11355

Product Family

Polymer Family

Processing Technology

Where to buy

Colors

Features

Industry

Applications

Technical Datasheet Data

ELECTRICAL

FLAME CHARACTERISTICS

IMPACT

INJECTION MOLDING

MECHANICAL

PHYSICAL

THERMAL

Curve Data

CAE Cards

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THIS SITE USES COOKIES

LNP™ THERMOCOMP™ Compound DX11355

Product Family

Polymer Family

Processing Technology

Where to buy

Colors

Features

Industry

Applications

Technical Datasheet Data

ELECTRICAL

FLAME CHARACTERISTICS

IMPACT

INJECTION MOLDING

MECHANICAL

PHYSICAL

THERMAL

Curve Data

CAE Cards

Related Documents

Technical Data Sheets

Literature

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