LNP™ THERMOCOMP™ Compound EC008PXQ

LNP THERMOCOMP EC008PXQ compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Exceptional Processing, FAR25.853 Compliant.

Product Family

LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

Polyetherimide (PEI)

Processing Technology

Injection Molding

Where to buy

You can get in touch with us in these regions to buy the material

Colors

All colors are customizable. Refer our ColorXpress tool to check color availability

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Features

Key characteristics of the material

Carbon fiber filled
Electrically Conductive
Flame Retardant
High Flow
High stiffness/Strength
High temperature resistance
No PFAS intentionally added

Industry

Material previously used in

Aerospace
Automotive Under the Hood
Building Component
Electrical
Sport/Leisure

Applications

Possible usage of material

Air Cabin Interiors
Aircraft Seating
Building Accessory
Circuit Protection
Electronic Components
Enclosures
Surgical Devices

Technical Datasheet Data

View different characteristics of the material at a standard test conditions

Region

ELECTRICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Volume Resistivity	4.5E+02	Ω.cm	ASTM D257
Surface Resistivity	4.1E+03	Ω	ASTM D257

IMPACT

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Izod Impact, unnotched, 23°C	597	J/m	ASTM D4812
Izod Impact, notched, 23°C	74	J/m	ASTM D256
Instrumented Dart Impact Total Energy, 23°C	7	J	ASTM D3763
*Izod Impact, unnotched 80104 +23°C*	33	kJ/m²	ISO 180/1U
*Izod Impact, notched 80104 +23°C*	6	kJ/m²	ISO 180/1A

INJECTION MOLDING

PROPERTIES	TYPICAL VALUES	UNITS
Drying Temperature	150	°C
Drying Time	4 - 6	Hrs
Maximum Moisture Content	0.02	%
Melt Temperature	360 - 400	°C
Rear - Zone 1 Temperature	360 - 380	°C
Middle - Zone 2 Temperature	370 - 390	°C
Front - Zone 3 Temperature	380 - 400	°C
Nozzle Temperature	390 - 400	°C
Mold Temperature	140 - 180	°C
Back Pressure	0.3 - 0.7	MPa
Screw speed (Circumferential speed)	0.2 - 0.3	m/s
Vent Depth	0.025 - 0.076	mm

MECHANICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Tensile Stress, brk, Type I, 5 mm/min	272	MPa	ASTM D638
Tensile Strain, brk, Type I, 5 mm/min	1	%	ASTM D638
Tensile Modulus, 5 mm/min	38600	MPa	ASTM D638
Flexural Stress, brk, 1.3 mm/min, 50 mm span	372	MPa	ASTM D790
Flexural Modulus, 1.3 mm/min, 50 mm span	32600	MPa	ASTM D790
Hardness, Rockwell M	112	-	ASTM D785
Tensile Stress, break, 5 mm/min	247	MPa	ISO 527
Tensile Strain, break, 5 mm/min	0.9	%	ISO 527
Tensile Modulus, 1 mm/min	35480	MPa	ISO 527
Flexural Stress, break, 2 mm/min	364	MPa	ISO 178
Flexural Modulus, 2 mm/min	30560	MPa	ISO 178
Compressive Strength	222	MPa	SABIC method
Shear Modulus	4656	MPa	ASTM D732
Shear Strength	120	MPa	ASTM D732

PHYSICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Specific Gravity	1.44	-	ASTM D792
Density	1.43	g/cm³	ASTM D792
Moisture Absorption, (23°C/50% RH/24 hrs)	0.11	%	ASTM D570
Mold Shrinkage, flow, 24 hrs	0.1 - 0.3	%	ASTM D955
Mold Shrinkage, xflow, 24 hrs	0.1 - 0.5	%	ASTM D955
Melt Flow Rate, 380°C/6.7 kgf	15	g/10 min	ASTM D1238
Poisson's Ratio	0.4	-	ASTM E132

THERMAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
HDT, 1.82 MPa, 3.2mm, unannealed	193	°C	ASTM D648
CTE, -40°C to 150°C, flow	2.7E-06	1/°C	ASTM E831
CTE, -40°C to 150°C, xflow	3.6E-05	1/°C	ASTM E831

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LNP™ THERMOCOMP™ Compound EC008PXQ

Product Family

Polymer Family

Processing Technology

Where to buy

Colors

Features

Industry

Applications

Technical Datasheet Data

ELECTRICAL

IMPACT

INJECTION MOLDING

MECHANICAL

PHYSICAL

THERMAL

Curve Data

CAE Cards

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THIS SITE USES COOKIES

LNP™ THERMOCOMP™ Compound EC008PXQ

Product Family

Polymer Family

Processing Technology

Where to buy

Colors

Features

Industry

Applications

Technical Datasheet Data

ELECTRICAL

IMPACT

INJECTION MOLDING

MECHANICAL

PHYSICAL

THERMAL

Curve Data

CAE Cards

Related Documents

Technical Data Sheets

Literature

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