LNP™ THERMOCOMP™ Compound HF006EU

LNP THERMOCOMP HF006EU compound is based on Nylon 11 resin containing 30% glass fiber. Added features of this grade include: Easy Molding, UV-Stabilized.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyamide 11 (Nylon 11)

Processing Technology

  • Injection Molding