LNP™ THERMOCOMP™ Compound MF006S

LNP THERMOCOMP MF006S compound is based on Polypropylene (PP) resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polypropylene, Unspecified (PP, Unspecified)

Processing Technology

  • Injection Molding