LNP™ THERMOCOMP™ Compound NX11302

LNP THERMOCOMP NX11302 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing proprietary fillers. Added features of this grade include: Colorable, Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications.

Product Family

LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

Polycarbonate + ABS (PC+ABS)

Processing Technology

Injection Molding

Where to buy

You can get in touch with us in these regions to buy the material

Colors

All colors are customizable. Refer our ColorXpress tool to check color availability

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Features

Key characteristics of the material

Dielectrics
Laser Direct Structuring
No PFAS intentionally added

Industry

Material previously used in

Automotive Interiors
Electrical
Mobile Phone - Computer - Tablets
Personal Accessory

Applications

Possible usage of material

Technical Datasheet Data

View different characteristics of the material at a standard test conditions

Region

ELECTRICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Relative Permittivity, 1 GHz	2.94	-	IEC 60250
Dissipation Factor, 1 GHz	0.0057	-	IEC 60250

FLAME CHARACTERISTICS

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
UL Yellow Card Link	View	-	-
UL Recognized, 94HB Flame Class Rating	≥0.6	mm	UL 94

IMPACT

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Izod Impact, notched, 23°C	550	J/m	ASTM D256

INJECTION MOLDING

PROPERTIES	TYPICAL VALUES	UNITS
Drying Temperature	85 - 95	°C
Drying Time	2 - 4	Hrs
Drying Time (Cumulative)	8	Hrs
Maximum Moisture Content	0.01	%
Melt Temperature	220 - 260	°C
Nozzle Temperature	220 - 260	°C
Front - Zone 3 Temperature	215 - 255	°C
Middle - Zone 2 Temperature	215 - 255	°C
Rear - Zone 1 Temperature	200 - 250	°C
Mold Temperature	40 - 75	°C
Back Pressure	0.5 - 0.9	MPa
Screw Speed	50 - 100	rpm
Shot to Cylinder Size	50 - 70	%
Vent Depth	0.038 - 0.051	mm

MECHANICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Tensile Stress, yld, Type I, 50 mm/min	47	MPa	ASTM D638
Tensile Stress, brk, Type I, 50 mm/min	46	MPa	ASTM D638
Tensile Strain, yld, Type I, 50 mm/min	4.6	%	ASTM D638
Tensile Strain, brk, Type I, 50 mm/min	75	%	ASTM D638
Tensile Modulus, 50 mm/min	2350	MPa	ASTM D638
Flexural Stress, yld, 1.3 mm/min, 50 mm span	79	MPa	ASTM D790
Flexural Stress, brk, 1.3 mm/min, 50 mm span	78	MPa	ASTM D790
Flexural Modulus, 1.3 mm/min, 50 mm span	2230	MPa	ASTM D790

PHYSICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Density	1.22	g/cm³	ASTM D792
Water Absorption, (23°C/24hrs)	0.01	%	ASTM D570
Moisture Absorption, (23°C/50% RH/24 hrs)	0.01	%	ASTM D570
Mold Shrinkage, flow, 24 hrs	0.6	%	ASTM D955
Mold Shrinkage, xflow, 24 hrs	0.6	%	ASTM D955
Melt Volume Rate, MVR at 260°C/5.0 kg	14	cm³/10 min	ISO 1133

THERMAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
HDT, 1.82 MPa, 3.2mm, unannealed	106	°C	ASTM D648
CTE, -40°C to 40°C, flow	7.1E-05	1/°C	ASTM E831
CTE, -40°C to 40°C, xflow	7.6E-05	1/°C	ASTM E831
Relative Temp Index, Elec	60	°C	UL 746B
Relative Temp Index, Mech w/impact	60	°C	UL 746B
Relative Temp Index, Mech w/o impact	60	°C	UL 746B

Curve Data

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CAE Cards