LNP™ THERMOCOMP™ Compound RC008
LNP THERMOCOMP RC008 compound is based on Nylon 6/6 resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive.
Product Family
- LNP™ COMPOUNDS AND PC COPOLYMER RESINS
Polymer Family
- Polyamide 66 (Nylon 66)
Processing Technology
- Injection Molding