ELECTRICAL
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Dielectric Constant, 1.9 GHz | 6.2 | - | SABIC method |
Dissipation Factor, 1.9 GHz | 0.015 | - | SABIC method |
LNP THERMOCOMP UX08319 compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Dielectric Properties.
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PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Dielectric Constant, 1.9 GHz | 6.2 | - | SABIC method |
Dissipation Factor, 1.9 GHz | 0.015 | - | SABIC method |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Izod Impact, notched, 23°C | 40 | J/m | ASTM D256 |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Drying Temperature | 120 - 130 | °C | |
Drying Time | 4 - 6 | Hrs | |
Melt Temperature | 315 - 330 | °C | |
Front - Zone 3 Temperature | 300 - 330 | °C | |
Middle - Zone 2 Temperature | 310 - 330 | °C | |
Rear - Zone 1 Temperature | 300 - 320 | °C | |
Mold Temperature | 140 - 165 | °C | |
Back Pressure | 20 - 40 | MPa | |
Screw Speed | 30 - 70 | rpm |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Tensile Stress, brk, Type I, 5 mm/min | 125 | MPa | ASTM D638 |
Tensile Strain, brk, Type I, 5 mm/min | 1.4 | % | ASTM D638 |
Tensile Modulus, 5 mm/min | 13784 | MPa | ASTM D638 |
Flexural Stress, yld, 1.3 mm/min, 50 mm span | 185 | MPa | ASTM D790 |
Flexural Modulus, 1.3 mm/min, 50 mm span | 11500 | MPa | ASTM D790 |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
Density | 2.14 | g/cm³ | ASTM D792 |
Mold Shrinkage, flow | 0.33 | % | SABIC method |
Mold Shrinkage, xflow | 0.35 | % | SABIC method |
PROPERTIES | TYPICAL VALUES | UNITS | TEST METHODS |
---|---|---|---|
HDT, 1.82 MPa, 3.2mm, unannealed | 265 | °C | ASTM D648 |
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