LNP™ THERMOCOMP™ Compound UX08319

LNP THERMOCOMP UX08319 compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Dielectric Properties.

Product Family

  • LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

  • Polyphthalamide (PPA)

Processing Technology

  • Injection Molding