LNP™ THERMOCOMP™ Compound UX08325

LNP THERMOCOMP UX08325 compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, SMT Process capable.

Product Family

LNP™ COMPOUNDS AND PC COPOLYMER RESINS

Polymer Family

Polyphthalamide (PPA)

Processing Technology

Injection Molding

Where to buy

You can get in touch with us in these regions to buy the material

Colors

All colors are customizable. Refer our ColorXpress tool to check color availability

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Features

Key characteristics of the material

Dielectrics
High stiffness/Strength
High temperature resistance
Laser Direct Structuring
No PFAS intentionally added

Industry

Material previously used in

Automotive Interiors
Electrical
Mobile Phone - Computer - Tablets
Personal Accessory

Applications

Possible usage of material

mobile phone antenna
laptop antenna
lds
laser direct structuring
vcm
5g dipole antenna
dielectric
smt

Technical Datasheet Data

View different characteristics of the material at a standard test conditions

Region

ELECTRICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Relative Permittivity, 1 GHz	4.2	-	ASTM D150
Dissipation Factor, 1 GHz	0.01	-	ASTM D150

FLAME CHARACTERISTICS

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
UL Yellow Card Link	View	-	-
UL Recognized, 94HB Flame Class Rating	≥1.5	mm	UL 94

IMPACT

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Izod Impact, unnotched, 23°C	351	J/m	ASTM D4812
Izod Impact, notched, 23°C	31	J/m	ASTM D256
*Izod Impact, notched 80104 +23°C*	2	kJ/m²	ISO 180/1A

INJECTION MOLDING

PROPERTIES	TYPICAL VALUES	UNITS
Drying Temperature	120 - 150	°C
Drying Time	4	Hrs
Maximum Moisture Content	0.15	%
Melt Temperature	315 - 330	°C
Front - Zone 3 Temperature	325 - 340	°C
Middle - Zone 2 Temperature	315 - 325	°C
Rear - Zone 1 Temperature	310 - 320	°C
Mold Temperature	140 - 165	°C
Back Pressure	0.2 - 0.3	MPa
Screw Speed	30 - 60	rpm

MECHANICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Tensile Stress, brk, Type I, 5 mm/min	135	MPa	ASTM D638
Tensile Strain, brk, Type I, 5 mm/min	1.8	%	ASTM D638
Tensile Modulus, 5 mm/min	10880	MPa	ASTM D638
Flexural Stress, yld, 1.3 mm/min, 50 mm span	197	MPa	ASTM D790
Flexural Stress, brk, 1.3 mm/min, 50 mm span	194	MPa	ASTM D790
Flexural Modulus, 1.3 mm/min, 50 mm span	9770	MPa	ASTM D790
Tensile Stress, break, 5 mm/min	125	MPa	ISO 527
Tensile Strain, break, 5 mm/min	1.6	%	ISO 527
Tensile Modulus, 1 mm/min	11080	MPa	ISO 527
Flexural Stress, yield, 2 mm/min	194	MPa	ISO 178
Flexural Strain, break, 2 mm/min	2	%	ISO 178
Flexural Modulus, 2 mm/min	9610	MPa	ISO 178

PHYSICAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
Density	1.55	g/cm³	ASTM D792
Mold Shrinkage, flow	0.41	%	SABIC method
Mold Shrinkage, xflow	0.52	%	SABIC method
Moisture Absorption (23°C / 50% RH)	0.53	%	ISO 62

THERMAL

PROPERTIES	TYPICAL VALUES	UNITS	TEST METHODS
HDT, 1.82 MPa, 3.2mm, unannealed	263	°C	ASTM D648
CTE, -40°C to 40°C, flow	2.2E-05	1/°C	ASTM E831
CTE, -40°C to 40°C, xflow	5.4E-05	1/°C	ASTM E831
*HDT/Af, 1.8 MPa Flatw 80104 sp=64mm*	261	°C	ISO 75/Af

Curve Data

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CAE Cards