Dianhydrides & Imides BISDA

BISDA (4,4-Bisphenol A Dianhydride) (dianhydrides of BPA) is a flake that can be used as a comonomer in polyimide synthesis or as an anhydride curing agent in epoxy. When used as an epoxy curative, BISDA can be used to enhance thermal performance in comparison to mono anhydrides and aromatic amine curing agents. Application areas include electronics encapsulation, composites, and adhesives. BISDA derived polyimide varnishes, coatings, adhesives, films and wire enamels meet desired solubility/stability in organic solvents even after complete imidization, heat resistance, flexibility/softness, dimensional stability and adhesion properties for ever-increasing design complexity of electronics devices.

Product Family


Polymer Family

Processing Technology