AN INTRODUCTION OF LNP™ LDS SOLUTION
• LDS Basic Introduction
• LNP TM LDS Product Portfolio Introduction & Features
• The Introduction of Newly Commercialized LDS Grades
• LDS Recommended Processing Guideline
• Case Study
LDS BASIC CONCEPT
Selective metallization of thermoplastics injection molded parts by Laser Direct Structuring
LPKF developed Molded Interconnect Device (MID) technology in 1997 as a laser based procedure for the production of MIDs, called the LPKF LDS Process.
Benefits of LDS:
• Full 3D Capability - System Integration
• Fast and easy design changes - speed to market
• No layout specific tooling - lower cost
• Fine pitch resolution - miniaturization
• High cost efficiency - fine structure and small production
LDS BASIC PROCESS
LDS PROCESS INTRODUCTION
LPKF LDS PROCESS VALUE PROPOSITION
LNP™ THERMOCOMP™ LDS COMPOUNDS
LNP™ LDS SOLUTION INTRODUCTION
LNP™ THERMOCOMP™ LDS PORTFOLIO - 1
LNP™ THERMOCOMP™ LDS PORTOFOLIO BEYOND PC BASE
LNP™ THERMOCOMP™ COMPOUND LDS GRADE DATA SHEET
LNP™ THERMOCOMP™ LDS PORTFOLIO VALUE PROPOSITION
LNP THERMOCOMP LDS Compounds Can Provide:
• High flow with superior impact performance with UL94 V 0 rating down to 0.6 mm (PC base resin)
• Wide color space with patented technology
• More complete portfolio
• Various Dk/Df LDS grades for different applications requiring good dielectric properties
• High stiffness and modulus with good aesthetics
• High heat material for lead free soldering with UL94 V 0 rating down to 0.4 mm
THE INTRODUCTION OF NEWLY COMMERCIALIZED LDS GRADES
LNP™ THERMOCOMP™ D10001VP(ER008312) INTRODUCTION
LNP THERMOCOMP D10001VP(ER008312) is a PC based non Chlorinated and non Brominated FR UL94 V0 1.5mm for Laser Direct Structuring application
Features:
• Robust FR performance
• UL 746C F1
• High impact strength under low temperature
• Good process ability
• UL94V0
Potential Applications:
• Outdoor application requiring UV exposure and water immersion
• Circuit replacement requiring fine pitch and 3D pattern
• Other applications requiring LDS capable, high impact , UL 746C F1 and UL94 V0
LNP™ THERMOCOMP™ 8K008V (ER010182) INTRODUCTION
LNP THERMOCOMP 8K008V(ER010182) is Liquid Crystalline Polymer (LCP) based compound for Laser Direct Structuring application
Features:
• High heat resistance for SMT processing
• Smooth surface
• Low Warpage
• Stable dielectric performance
• Easy plating
• UL94V0
Potential Applications:
• Optical communication module , 5G AAU dipole , OIS VCM , Antenna for laptop and wearable device , Endoscope antenna, POS security module
LNP™ THERMOCOMP™ 8MF44VE (ER010302) INTRODUCTION
LNP THERMOCOMP 8MF44VE (ER010302) is a Liquid Crystalline Polymer (LCP) based compound for Laser Direct Structuring application
Features:
• High heat resistance for robust SMT processing
• High adhesion strength
• Good welding line strength
• Low warpage
• Easy plating
• UL94V0
Potential Applications:
• Optical communication module, 5G AAU dipole , OIS VCM , Antenna for laptop and wearable device , Endoscope antenna, POS security module
LNP™ 8K008V / 8KF44VE PERFORMANCE AND VALUE PROPOSITION
LNP™ THERMOCOMP™ 8MF44VG (ER010710) INTRODUCTION
LNP THERMOCOMP 8MF44VG (ER010710) is a Liquid Crystalline Polymer (LCP) based compound for Laser Direct Structuring application
Features:
• High heat resistance for robust SMT processing
• Smooth surface
• DK 3.2 / Df 0.003
• Low warpage
• UL94 V0
Potential Applications:
• Laptop antenna is requested low Dk and Low Df , SMT capable , LDS , High flow , and Halogen FR V0
• Wearable device antenna
LNP™ THERMOCOMP™ OFC08V (ER011248) INTRODUCTION
LNP THERMOCOMP OFC08V (ER011248) is a PPS based with glass fiber reinforced compound for Laser Direct Structuring application
Features:
• High heat resistance for SMT processing
• High modulus and strength
• Good impact strength and ductility
• Excellent heat and chemical resistance
• UL94 V0
• Good flash control
Potential Applications:
• 5G dipole antenna ,Electric and electronic components , and various parts requiring high strength and high heat resistance
LNP™ THERMOCOMP™ DX11355RC(ER009131) INTRODUCTION
LNP THERMOCOMP DX11355RC(ER009131) compound is based on recycled Polycarbonate (PC) resin. Added features of this grade include: Good Surface, Good Ductility, Non Brominated & Non Chlorinated Flame Retardant. Post Consumer Recycling (PCR) Polycarbonate content up to 50% for Laser Direct Structuring application
Features:
• Flame retardant
• Post Consumer Recycled (PCR)
• Non Brominated, Non Chlorinated
• Laser Direct Structuring
Potential Applications:
• Personal accessory
• Electrical devices and displays, Electrical components and infrastructure
LNP™ THERMOCOMP™ WF006V (ER010941) INTRODUCTION
LNP THERMOCOMP WF006V compound is a 30% glass fiber reinforced PBT resin based LDS material solution with good plating and stable RF performance. Wide processing window makes it a good candidate for internal and external parts for Laser Direct Structuring applications.
Features:
• Chemical Resistance
• High Heat Resistance
• Good Tensile Strength
• Enhanced Ductility
• Low warpage
Potential Applications:
• Smart phone antenna , Wearable device antenna, Animal tracker
PROCESSING GUIDE
- DESIGN GUIDE & INJECTION TROUBLESHOOTING
- LASER ACTIVATION PLATING
LDS DESIGN GUIDELINES (SUMMARY)
• Avoid using aluminum based tool for LDS material injection
• Sharp edged transition around the metallization structure should be avoided
• Avoid injection point and ejector locating around the metallization area
• Avoid gate & weld line on metallization area
• Flow mark & gas trap should not be on metallization area.
• Silicon based mold releasing agent should not be used during injection
• With GF filled grade, must follow general rules to minimize glass floating on surface
• Choose the optimal material based on the application and follow the processing guidelines
• Material recycling must be prevented
LDS DESIGN GUIDELINES
TROUBLE SHOOTING
LASER ACTIVATION PLATING
RECOMMENDED LASER OPERATING PARAMETERS
PLATING PROCESS COMPARISON
MACDERMID MID COPPER 100 XD PLATING SOLUTION
CASE STUDY
CASE STUDY - LNP™ THERMOCOMP™ DX13354 IN SMART WATCH ANTENNA
Application: Smart watch antenna and cover integration part
Application Requirements
• Good balance of modulus and impact
• Good dimension stability, especially after painting
• Good surface
Value Proposition By Using DX13354
• Integration design for various antenna, structure part and circuit
• Lower cost
• Simplify assembly process
PRODUCTS AND GRADES
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